These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

111 related articles for article (PubMed ID: 38673201)

  • 1. Effect of Grain Structure of Gold Plating Layer on Environmental Reliability of Sintered Ag-Au Joints.
    Ma Y; Li X; Zhang H
    Materials (Basel); 2024 Apr; 17(8):. PubMed ID: 38673201
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications.
    Yoon JW; Back JH
    Materials (Basel); 2018 Oct; 11(11):. PubMed ID: 30373139
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors.
    Noh S; Zhang H; Suganuma K
    Materials (Basel); 2018 Dec; 11(12):. PubMed ID: 30545143
    [TBL] [Abstract][Full Text] [Related]  

  • 4. High-Pressure-Assisted Large-Area (>2400 mm
    Xue J; Li X
    Materials (Basel); 2024 Apr; 17(8):. PubMed ID: 38673268
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections.
    Lu YC; Liao WH; Wu TJ; Yasuda K; Song JM
    Nanomaterials (Basel); 2022 Nov; 12(23):. PubMed ID: 36500864
    [TBL] [Abstract][Full Text] [Related]  

  • 6. High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste.
    Shen X; Li J; Xi S
    Nanomaterials (Basel); 2022 Sep; 12(19):. PubMed ID: 36234479
    [TBL] [Abstract][Full Text] [Related]  

  • 7. One-Step Fabrication of 3D Nanohierarchical Nickel Nanomace Array To Sinter with Silver NPs and the Interfacial Analysis.
    Zhou W; Zheng Z; Wang C; Wang Z; An R
    ACS Appl Mater Interfaces; 2017 Feb; 9(5):4798-4807. PubMed ID: 28080029
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Development of Ag-In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices.
    Tsai CH; Huang WC; Kao CR
    Materials (Basel); 2022 Feb; 15(4):. PubMed ID: 35207937
    [TBL] [Abstract][Full Text] [Related]  

  • 9. A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading.
    Ma K; Liu X; Sun Y; Song Y; Feng Z; Zhou Y; Liu S
    Materials (Basel); 2023 Jun; 16(12):. PubMed ID: 37374655
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform.
    Zhang H; Xu H; Wang T; Wang S
    RSC Adv; 2023 Nov; 13(50):35683-35688. PubMed ID: 38077966
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles.
    Liu J; Chen H; Ji H; Li M
    ACS Appl Mater Interfaces; 2016 Dec; 8(48):33289-33298. PubMed ID: 27934145
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Ag Sinter Bonding to Si Substrate via Temporal Formation and Decomposition of Ag Carboxylate.
    Matsuda T; Kawabata R; Okamoto T; Hirose A
    Nanomaterials (Basel); 2023 Aug; 13(16):. PubMed ID: 37630877
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Effect of sintering process on microstructure, 4-point flexural strength, and grain size of yttria-stabilized tetragonal zirconia polycrystal for use in monolithic dental restorations.
    Catramby MF; do Vale AL; Dos Santos HES; Elias CN
    J Prosthet Dent; 2021 May; 125(5):824.e1-824.e8. PubMed ID: 33775390
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics.
    Wu Z; Liu W; Feng J; Wen Z; Zhang X; Wang X; Wang C; Tian Y
    ACS Omega; 2023 Aug; 8(34):31021-31029. PubMed ID: 37663465
    [TBL] [Abstract][Full Text] [Related]  

  • 15. A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging.
    Wang J; Wang X; Zhang L; Zhang L; Duan F; Wang F; Zhang W; Wang J; Zhang Z; Hang C; Chen H
    Materials (Basel); 2022 Jan; 15(3):. PubMed ID: 35160861
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications.
    Li M; Xiao Y; Zhang Z; Yu J
    ACS Appl Mater Interfaces; 2015 May; 7(17):9157-68. PubMed ID: 25890996
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Surface Composition and Crystallinity of Coalescing Silver-Gold Nanoparticles.
    Goudeli E; Pratsinis SE
    ACS Nano; 2017 Nov; 11(11):11653-11660. PubMed ID: 29112816
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering.
    Han SJ; Lee S; Jang KS
    Polymers (Basel); 2024 Jan; 16(3):. PubMed ID: 38337287
    [TBL] [Abstract][Full Text] [Related]  

  • 19. The effects of sintering temperature and duration on the flexural strength and grain size of zirconia.
    Ersoy NM; Aydoğdu HM; Değirmenci BÜ; Çökük N; Sevimay M
    Acta Biomater Odontol Scand; 2015 Dec; 1(2-4):43-50. PubMed ID: 28642900
    [No Abstract]   [Full Text] [Related]  

  • 20. Physical Characteristics of Sintered Silver Nanoparticle Inks with Different Sizes during Furnace Sintering.
    Park HJ; Ryu K; Lee HL; Moon YJ; Hwang JY; Moon SJ
    Materials (Basel); 2024 Feb; 17(5):. PubMed ID: 38473451
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.