These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
139 related articles for article (PubMed ID: 38730955)
1. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu. Li YJ; Yen YW; Chen CM Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955 [TBL] [Abstract][Full Text] [Related]
2. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition. Wang Q; Chen H; Wang F Materials (Basel); 2019 Dec; 12(24):. PubMed ID: 31861193 [TBL] [Abstract][Full Text] [Related]
3. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene. Ko YH; Lee JD; Yoon T; Lee CW; Kim TS ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638 [TBL] [Abstract][Full Text] [Related]
4. Effects of Initial Morphology on Growth Kinetics of Cu Lee JY; Chen CM Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888218 [TBL] [Abstract][Full Text] [Related]
8. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing. Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200 [TBL] [Abstract][Full Text] [Related]
9. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test. Jeong H; Myung WR; Sung YG; Kim KY; Jung SB J Nanosci Nanotechnol; 2018 Sep; 18(9):6316-6320. PubMed ID: 29677789 [TBL] [Abstract][Full Text] [Related]
10. Hybrid solder joints: the effect of nanosized ZrO Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828 [TBL] [Abstract][Full Text] [Related]
11. Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate. Kang MS; Kim DS; Shin YE Materials (Basel); 2019 Mar; 12(6):. PubMed ID: 30901825 [TBL] [Abstract][Full Text] [Related]
12. Intermetallic Growth Mechanism and Mechanical Properties of Post-Annealed SAC305 Solder Joints on Cu-Based Electrode Interfaces. Beck J; Baek YJ; Son S; Kim JB; Yang SH; Hyun SK J Nanosci Nanotechnol; 2019 Mar; 19(3):1645-1648. PubMed ID: 30469238 [TBL] [Abstract][Full Text] [Related]
13. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints. Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411 [TBL] [Abstract][Full Text] [Related]
14. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints. Wang F; Huang Y; Zhang Z; Yan C Materials (Basel); 2017 Aug; 10(8):. PubMed ID: 28792440 [TBL] [Abstract][Full Text] [Related]
15. Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates. Xiao J; Tong X; Liang J; Chen Q; Tang Q Heliyon; 2023 Feb; 9(2):e12952. PubMed ID: 36747560 [TBL] [Abstract][Full Text] [Related]
16. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate. Son J; Yu DY; Kim YC; Kim SI; Kim MS; Byun D; Bang J Materials (Basel); 2021 May; 14(9):. PubMed ID: 34063188 [TBL] [Abstract][Full Text] [Related]
17. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints. Zhang C; Zhang K; Gao Y; Wang Y Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920 [TBL] [Abstract][Full Text] [Related]
18. Microstructural study on Kirkendall void formation in Sn-containing/Cu solder joints during solid-state aging. Liu ZQ; Shang PJ; Tan F; Li D Microsc Microanal; 2013 Aug; 19 Suppl 5():105-8. PubMed ID: 23920185 [TBL] [Abstract][Full Text] [Related]
19. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. Zhao D; Zhang K; Ma N; Li S; Yin C; Huo F Materials (Basel); 2020 Feb; 13(4):. PubMed ID: 32059528 [TBL] [Abstract][Full Text] [Related]
20. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging. Xin M; Wang X; Sun F J Mater Sci Mater Electron; 2022; 33(33):25025-25040. PubMed ID: 38625275 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]