These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

141 related articles for article (PubMed ID: 38793430)

  • 1. Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review.
    Li L; Du X; Chen J; Wu Y
    Materials (Basel); 2024 May; 17(10):. PubMed ID: 38793430
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Reliability issues of lead-free solder joints in electronic devices.
    Jiang N; Zhang L; Liu ZQ; Sun L; Long WM; He P; Xiong MY; Zhao M
    Sci Technol Adv Mater; 2019; 20(1):876-901. PubMed ID: 31528239
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions.
    Jian M; Hamasha S; Alahmer A; Hamasha M; Wei X; Belhadi MEA; Hamasha K
    Materials (Basel); 2023 Jan; 16(2):. PubMed ID: 36676490
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.
    Ramli MII; Salleh MAAM; Abdullah MMAB; Zaimi NSM; Sandu AV; Vizureanu P; Rylski A; Amli SFM
    Materials (Basel); 2022 Feb; 15(4):. PubMed ID: 35207990
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures.
    Chen C; Sun M; Cheng Z; Liang Y
    Materials (Basel); 2022 Jan; 15(3):. PubMed ID: 35160725
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis.
    Hu X; Liu L; Liu S; Ruan M; Chen Z
    Micromachines (Basel); 2023 Feb; 14(3):. PubMed ID: 36984994
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact.
    Liu Z; Fang M; Shi L; Gu Y; Chen Z; Zhu W
    Micromachines (Basel); 2022 Feb; 13(2):. PubMed ID: 35208406
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.
    Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
    Polymers (Basel); 2024 Sep; 16(18):. PubMed ID: 39339061
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 10. The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys.
    Akkara FJ; Hamasha S; Alahmer A; Evans J; Belhadi MEA; Wei X
    Materials (Basel); 2022 Sep; 15(19):. PubMed ID: 36234099
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions.
    Ting Tan A; Wen Tan A; Yusof F
    Sci Technol Adv Mater; 2015 Jun; 16(3):033505. PubMed ID: 27877786
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling.
    Cui J; Zhang K; Zhao D; Pan Y
    Sci Rep; 2021 Mar; 11(1):6297. PubMed ID: 33737642
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model.
    Bani Hani D; Al Athamneh R; Abueed M; Hamasha S
    Sci Rep; 2023 Feb; 13(1):2493. PubMed ID: 36781927
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data.
    Mi J; Li YF; Yang YJ; Peng W; Huang HZ
    ScientificWorldJournal; 2014; 2014():807693. PubMed ID: 25121138
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
    ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
    [TBL] [Abstract][Full Text] [Related]  

  • 16. The role of microstructure in the thermal fatigue of solder joints.
    Xian JW; Xu YL; Stoyanov S; Coyle RJ; Dunne FPE; Gourlay CM
    Nat Commun; 2024 May; 15(1):4258. PubMed ID: 38769155
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Research on life evaluation method of solder joint based on eddy current pulse thermography.
    Zhou X; Lu X; Cao X; Liu Z; Chen Y
    Rev Sci Instrum; 2019 Aug; 90(8):084901. PubMed ID: 31472622
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints.
    Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
    Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish.
    Chi P; Li Y; Pan H; Wang Y; Chen N; Li M; Gao L
    Materials (Basel); 2021 Dec; 14(24):. PubMed ID: 34947470
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation.
    Chen J; Liu B; Hu M; Huang S; Yu S; Wu Y; Yang J
    Materials (Basel); 2023 May; 16(9):. PubMed ID: 37176386
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 8.