These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

107 related articles for article (PubMed ID: 38847403)

  • 41. Improvement of the Thermal Conductivity and Mechanical Properties of 3D-Printed Polyurethane Composites by Incorporating Hydroxylated Boron Nitride Functional Fillers.
    Su KH; Su CY; Shih WL; Lee FT
    Materials (Basel); 2022 Dec; 16(1):. PubMed ID: 36614693
    [TBL] [Abstract][Full Text] [Related]  

  • 42. Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy-Hexagonal Boron Nitride-Graphene Oxide.
    Chen P; Ge X; Zhang Z; Yin S; Liang W; Ge J
    Nanomaterials (Basel); 2023 Jan; 13(3):. PubMed ID: 36770451
    [TBL] [Abstract][Full Text] [Related]  

  • 43. Hot-Pressed Super-Elastic Graphene Aerogel with Bidirectional Thermal Conduction Properties as Thermal Interface Materials.
    Lv P; Zhou X; Chen S
    Materials (Basel); 2023 Nov; 16(23):. PubMed ID: 38068163
    [TBL] [Abstract][Full Text] [Related]  

  • 44. Generation of Self-Assembled 3D Network in TPU by Insertion of Al
    Su KH; Su CY; Chi PW; Chandan P; Cho CT; Chi WY; Wu MK
    Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33418935
    [TBL] [Abstract][Full Text] [Related]  

  • 45. Thermal Conductance of the 2D MoS
    Liu Y; Ong ZY; Wu J; Zhao Y; Watanabe K; Taniguchi T; Chi D; Zhang G; Thong JT; Qiu CW; Hippalgaonkar K
    Sci Rep; 2017 Mar; 7():43886. PubMed ID: 28262778
    [TBL] [Abstract][Full Text] [Related]  

  • 46. Thermal and Electrical Properties of Additively Manufactured Polymer-Boron Nitride Composite.
    Bondareva JV; Chernodoubov DA; Dubinin ON; Tikhonov AA; Simonov AP; Suetin NV; Tarkhov MA; Popov ZI; Kvashnin DG; Evlashin SA; Safonov AA
    Polymers (Basel); 2023 Feb; 15(5):. PubMed ID: 36904455
    [TBL] [Abstract][Full Text] [Related]  

  • 47. Configurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performances.
    Loeblein M; Tay RY; Tsang SH; Ng WB; Teo EH
    Small; 2014 Aug; 10(15):2992-9. PubMed ID: 24789084
    [TBL] [Abstract][Full Text] [Related]  

  • 48. Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride.
    Mai VD; Lee DI; Park JH; Lee DS
    Polymers (Basel); 2019 Apr; 11(4):. PubMed ID: 30960581
    [TBL] [Abstract][Full Text] [Related]  

  • 49. Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy.
    Zhang XD; Zhang ZT; Wang HZ; Cao BY
    ACS Appl Mater Interfaces; 2023 Jan; 15(2):3534-3542. PubMed ID: 36604306
    [TBL] [Abstract][Full Text] [Related]  

  • 50. A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties.
    Kwon YJ; Park JB; Jeon YP; Hong JY; Park HS; Lee JU
    Polymers (Basel); 2021 Apr; 13(8):. PubMed ID: 33923627
    [TBL] [Abstract][Full Text] [Related]  

  • 51. Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes.
    Su Z; Wang H; He J; Guo Y; Qu Q; Tian X
    ACS Appl Mater Interfaces; 2018 Oct; 10(42):36342-36351. PubMed ID: 30264559
    [TBL] [Abstract][Full Text] [Related]  

  • 52. Robust, Self-Healing, and Multi-Use Poly(Urethane-Urea-Imide) Elastomer as a Durable Adhesive for Thermal Interface Materials.
    Wu Z; Dong J; Guo H; Shang R; Qin X; Xia Y; Li X; Zhao X; Ji C; Zhang Q
    Small; 2024 Aug; 20(34):e2401815. PubMed ID: 38573922
    [TBL] [Abstract][Full Text] [Related]  

  • 53. Graphene-Assisted Thermal Interface Materials with a Satisfied Interface Contact Level Between the Matrix and Fillers.
    Tang B; Li X; Huang W; Yu H; Ling X
    Nanoscale Res Lett; 2018 Sep; 13(1):276. PubMed ID: 30203134
    [TBL] [Abstract][Full Text] [Related]  

  • 54. Coupled Chiral Structure in Graphene-Based Film for Ultrahigh Thermal Conductivity in Both In-Plane and Through-Plane Directions.
    Meng X; Pan H; Zhu C; Chen Z; Lu T; Xu D; Li Y; Zhu S
    ACS Appl Mater Interfaces; 2018 Jul; 10(26):22611-22622. PubMed ID: 29888597
    [TBL] [Abstract][Full Text] [Related]  

  • 55. Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader.
    Yan Q; Dai W; Gao J; Tan X; Lv L; Ying J; Lu X; Lu J; Yao Y; Wei Q; Sun R; Yu J; Jiang N; Chen D; Wong CP; Xiang R; Maruyama S; Lin CT
    ACS Nano; 2021 Apr; 15(4):6489-6498. PubMed ID: 33734662
    [TBL] [Abstract][Full Text] [Related]  

  • 56. Vertically Aligned High-Quality Graphene Foams for Anisotropically Conductive Polymer Composites with Ultrahigh Through-Plane Thermal Conductivities.
    An F; Li X; Min P; Liu P; Jiang ZG; Yu ZZ
    ACS Appl Mater Interfaces; 2018 May; 10(20):17383-17392. PubMed ID: 29706070
    [TBL] [Abstract][Full Text] [Related]  

  • 57. Thermal interface material with graphene enhanced sintered copper for high temperature power electronics.
    Deng S; Zhang X; Xiao GD; Zhang K; He X; Xin S; Liu X; Zhong A; Chai Y
    Nanotechnology; 2021 May; 32(31):. PubMed ID: 33910177
    [TBL] [Abstract][Full Text] [Related]  

  • 58. Covalently Functionalized Leakage-Free Healable Phase-Change Interface Materials with Extraordinary High-Thermal Conductivity and Low-Thermal Resistance.
    Abdul Jaleel SA; Kim T; Baik S
    Adv Mater; 2023 Jul; 35(30):e2300956. PubMed ID: 37094881
    [TBL] [Abstract][Full Text] [Related]  

  • 59. Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials.
    Barako MT; Isaacson SG; Lian F; Pop E; Dauskardt RH; Goodson KE; Tice J
    ACS Appl Mater Interfaces; 2017 Dec; 9(48):42067-42074. PubMed ID: 29119783
    [TBL] [Abstract][Full Text] [Related]  

  • 60. The Dielectrophoretic Alignment of Biphasic Metal Fillers for Thermal Interface Materials.
    Lee Y; Akyildiz K; Kang C; So JH; Koo HJ
    Polymers (Basel); 2023 Dec; 15(24):. PubMed ID: 38139905
    [TBL] [Abstract][Full Text] [Related]  

    [Previous]   [Next]    [New Search]
    of 6.