104 related articles for article (PubMed ID: 38941591)
1. Scalable Compliant Graphene Fiber-Based Thermal Interface Material with Metal-Level Thermal Conductivity via Dual-Field Synergistic Alignment Engineering.
Lu J; Ming X; Cao M; Liu Y; Wang B; Shi H; Hao Y; Zhang P; Li K; Wang L; Li P; Gao W; Cai S; Sun B; Yu ZZ; Xu Z; Gao C
ACS Nano; 2024 Jun; ():. PubMed ID: 38941591
[TBL] [Abstract][Full Text] [Related]
2. Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials.
Dai W; Ma T; Yan Q; Gao J; Tan X; Lv L; Hou H; Wei Q; Yu J; Wu J; Yao Y; Du S; Sun R; Jiang N; Wang Y; Kong J; Wong C; Maruyama S; Lin CT
ACS Nano; 2019 Oct; 13(10):11561-11571. PubMed ID: 31550125
[TBL] [Abstract][Full Text] [Related]
3. Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction.
Dai W; Ren XJ; Yan Q; Wang S; Yang M; Lv L; Ying J; Chen L; Tao P; Sun L; Xue C; Yu J; Song C; Nishimura K; Jiang N; Lin CT
Nanomicro Lett; 2022 Dec; 15(1):9. PubMed ID: 36484932
[TBL] [Abstract][Full Text] [Related]
4. Highly Flexible Graphene Derivative Hybrid Film: An Outstanding Nonflammable Thermally Conductive yet Electrically Insulating Material for Efficient Thermal Management.
Vu MC; Kim IH; Choi WK; Lim CS; Islam MA; Kim SR
ACS Appl Mater Interfaces; 2020 Jun; 12(23):26413-26423. PubMed ID: 32469197
[TBL] [Abstract][Full Text] [Related]
5. Alveoli-Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High-Performance Thermal Interface Materials.
Zheng S; Xue H; Liu Y; Yu X; Cao Z
Small; 2024 Apr; 20(16):e2306750. PubMed ID: 38044278
[TBL] [Abstract][Full Text] [Related]
6. Soft and Damping Thermal Interface Materials with Honeycomb-Board-Mimetic Filler Network for Electronic Heat Dissipation.
Liu W; Liu Y; Zhong S; Chen J; Li Z; Zhang C; Jiang P; Huang X
Small; 2024 Apr; ():e2400115. PubMed ID: 38678491
[TBL] [Abstract][Full Text] [Related]
7. Vertically Aligned Boron Nitride Nanosheets Films for Superior Electronic Cooling.
Yang K; Yang X; Liu Z; Li K; Yue Y; Zhang R; Wang F; Shi X; Yuan J; Liu N; Wang G; Wang Z; Xin G
ACS Appl Mater Interfaces; 2023 Jun; 15(23):28536-28545. PubMed ID: 37264810
[TBL] [Abstract][Full Text] [Related]
8. A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material.
Lv L; Ying J; Chen L; Tao P; Sun L; Yang K; Fu L; Yu J; Yan Q; Dai W; Jiang N; Lin CT
Nanomaterials (Basel); 2023 Feb; 13(5):. PubMed ID: 36903671
[TBL] [Abstract][Full Text] [Related]
9. The Dielectrophoretic Alignment of Biphasic Metal Fillers for Thermal Interface Materials.
Lee Y; Akyildiz K; Kang C; So JH; Koo HJ
Polymers (Basel); 2023 Dec; 15(24):. PubMed ID: 38139905
[TBL] [Abstract][Full Text] [Related]
10. Tetris-Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation.
Han S; Ji Y; Zhang Q; Wu H; Guo S; Qiu J; Zhang F
Nanomicro Lett; 2023 Jun; 15(1):146. PubMed ID: 37286799
[TBL] [Abstract][Full Text] [Related]
11. Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications.
Chang G; Wang L; Zhang Y; Li X; Chen K; Kan D; Zhang W; Zhang S; Dong L; Li L; Bai X; Zhang H; Huo W
ACS Appl Mater Interfaces; 2022 Dec; 14(50):56156-56168. PubMed ID: 36508197
[TBL] [Abstract][Full Text] [Related]
12. Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design.
Kim W; Kim C; Lee W; Park J; Kim D
Biomolecules; 2021 Jan; 11(2):. PubMed ID: 33498514
[TBL] [Abstract][Full Text] [Related]
13. Chloroform-Assisted Rapid Growth of Vertical Graphene Array and Its Application in Thermal Interface Materials.
Xu S; Cheng T; Yan Q; Shen C; Yu Y; Lin CT; Ding F; Zhang J
Adv Sci (Weinh); 2022 May; 9(15):e2200737. PubMed ID: 35322591
[TBL] [Abstract][Full Text] [Related]
14. Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy.
Zhang XD; Zhang ZT; Wang HZ; Cao BY
ACS Appl Mater Interfaces; 2023 Jan; 15(2):3534-3542. PubMed ID: 36604306
[TBL] [Abstract][Full Text] [Related]
15. Vertically Aligned High-Quality Graphene Foams for Anisotropically Conductive Polymer Composites with Ultrahigh Through-Plane Thermal Conductivities.
An F; Li X; Min P; Liu P; Jiang ZG; Yu ZZ
ACS Appl Mater Interfaces; 2018 May; 10(20):17383-17392. PubMed ID: 29706070
[TBL] [Abstract][Full Text] [Related]
16. A Novel Thermal Interface Material Composed of Vertically Aligned Boron Nitride and Graphite Films for Ultrahigh Through-Plane Thermal Conductivity.
Bashir A; Niu H; Maqbool M; Usman A; Lv R; Ashraf Z; Cheng M; Bai S
Small Methods; 2024 Mar; ():e2301788. PubMed ID: 38507731
[TBL] [Abstract][Full Text] [Related]
17. Significantly enhanced phonon mean free path and thermal conductivity by percolation of silver nanoflowers.
Suh D; Lee S; Xu C; Jan AA; Baik S
Phys Chem Chem Phys; 2019 Jan; 21(5):2453-2462. PubMed ID: 30652710
[TBL] [Abstract][Full Text] [Related]
18. Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction.
Yu H; Peng L; Chen C; Qin M; Feng W
Nanomicro Lett; 2024 May; 16(1):198. PubMed ID: 38758464
[TBL] [Abstract][Full Text] [Related]
19. Synergistic Effect of Aligned Graphene Nanosheets in Graphene Foam for High-Performance Thermally Conductive Composites.
Wu Z; Xu C; Ma C; Liu Z; Cheng HM; Ren W
Adv Mater; 2019 May; 31(19):e1900199. PubMed ID: 30856289
[TBL] [Abstract][Full Text] [Related]
20. Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging.
Liu P; Luo Y; Liu J; Chiang SW; Wu D; Dai W; Kang F; Lin W; Wong CP; Yang C
ACS Appl Mater Interfaces; 2021 Apr; 13(13):15791-15801. PubMed ID: 33755413
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]