These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

185 related articles for article (PubMed ID: 8400445)

  • 21. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples.
    Yin Q; Gao F; Gu Z; Stach EA; Zhou G
    Nanoscale; 2015 Mar; 7(11):4984-94. PubMed ID: 25692392
    [TBL] [Abstract][Full Text] [Related]  

  • 22. The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration.
    Xu K; Fu X; Wang X; Fu Z; Yang X; Chen S; Shi Y; Huang Y; Chen H
    Materials (Basel); 2021 Dec; 15(1):. PubMed ID: 35009255
    [TBL] [Abstract][Full Text] [Related]  

  • 23. Cu
    Wang J; Wang J; Duan F; Chen H
    Sci Rep; 2023 Jan; 13(1):668. PubMed ID: 36635376
    [TBL] [Abstract][Full Text] [Related]  

  • 24. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
    Li YJ; Yen YW; Chen CM
    Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955
    [TBL] [Abstract][Full Text] [Related]  

  • 25. Molecular study of concentrated copper pollutant with a compost.
    Wei YL; Lee YC; Yang YW; Lee JF
    Chemosphere; 2004 Dec; 57(9):1201-5. PubMed ID: 15504480
    [TBL] [Abstract][Full Text] [Related]  

  • 26. Reflow and electrical characteristics of nanoscale solder.
    Gu Z; Ye H; Smirnova D; Small D; Gracias DH
    Small; 2006 Feb; 2(2):225-9. PubMed ID: 17193025
    [No Abstract]   [Full Text] [Related]  

  • 27. Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves.
    Li Z; Li M; Xiao Y; Wang C
    Ultrason Sonochem; 2014 May; 21(3):924-9. PubMed ID: 24279981
    [TBL] [Abstract][Full Text] [Related]  

  • 28. Hybrid solder joints: the effect of nanosized ZrO
    Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G
    Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828
    [TBL] [Abstract][Full Text] [Related]  

  • 29. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 30. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
    Ramli MII; Salleh MAAM; Sandu AV; Amli SFM; Said RM; Saud N; Abdullah MMAB; Vizureanu P; Rylski A; Chaiprapa J; Nabialek M
    Materials (Basel); 2021 Sep; 14(18):. PubMed ID: 34576358
    [TBL] [Abstract][Full Text] [Related]  

  • 31. Microstructural studies of 35 degrees C copper Ni-Ti orthodontic wire and TEM confirmation of low-temperature martensite transformation.
    Brantley WA; Guo W; Clark WA; Iijima M
    Dent Mater; 2008 Feb; 24(2):204-10. PubMed ID: 17561249
    [TBL] [Abstract][Full Text] [Related]  

  • 32. Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model.
    Qiu J; Peng Y; Gao P; Li C
    Materials (Basel); 2021 Apr; 14(9):. PubMed ID: 33946308
    [TBL] [Abstract][Full Text] [Related]  

  • 33. The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints.
    Fu X; Liu M; Xu K; Chen S; Shi Y; Fu Z; Huang Y; Chen H; Yao R
    Materials (Basel); 2020 Dec; 13(23):. PubMed ID: 33276575
    [TBL] [Abstract][Full Text] [Related]  

  • 34. Development of a cryogenic stage for an ion-milling instrument.
    Terauchi M; Satou F; Sugizaki H; Suganuma K
    J Electron Microsc (Tokyo); 2011; 60(1):25-7. PubMed ID: 20935132
    [TBL] [Abstract][Full Text] [Related]  

  • 35. Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates.
    Hurtony T; Krammer O; Illés B; Harsányi G; Bušek D; Dušek K
    Materials (Basel); 2020 Nov; 13(22):. PubMed ID: 33233687
    [TBL] [Abstract][Full Text] [Related]  

  • 36. Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints.
    Yang W; Yang Z; Fu Y; Yu A; Feng J; Zhan Y
    Materials (Basel); 2020 Sep; 13(18):. PubMed ID: 32911653
    [TBL] [Abstract][Full Text] [Related]  

  • 37. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.
    Son J; Yu DY; Kim YC; Kim SI; Kim MS; Byun D; Bang J
    Materials (Basel); 2021 May; 14(9):. PubMed ID: 34063188
    [TBL] [Abstract][Full Text] [Related]  

  • 38. On the effect of nanocrystallization and disorder on the magnetic properties of Cu-rich, FeMnCu alloys.
    Stewart SJ; Marco JF; Crespo P; Romero JJ; Martínez A; Hernando A; Palomares FJ; González JM
    J Nanosci Nanotechnol; 2007 Feb; 7(2):610-7. PubMed ID: 17450803
    [TBL] [Abstract][Full Text] [Related]  

  • 39. Mould filling of Ag-Pd-Cu-Au and Ag-Zn-Sn-In alloy castings made using a rapidly prepared gypsum-bonded investment material.
    Shimizu H; Inoue S; Miyauchi H; Watanabe K; Takahashi Y
    Eur J Prosthodont Restor Dent; 2008 Dec; 16(4):177-80. PubMed ID: 19177729
    [TBL] [Abstract][Full Text] [Related]  

  • 40. Leaded electronic waste is a possible source material for lead-contaminated jewelry.
    Weidenhamer JD; Clement ML
    Chemosphere; 2007 Oct; 69(7):1111-5. PubMed ID: 17532022
    [TBL] [Abstract][Full Text] [Related]  

    [Previous]   [Next]    [New Search]
    of 10.