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  • Title: Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems.
    Author: Cui Q, Gao F, Mukherjee S, Gu Z.
    Journal: Small; 2009 Jun; 5(11):1246-57. PubMed ID: 19387987.
    Abstract:
    Interconnect formation is critical for the assembly and integration of nanocomponents to enable nanoelectronics- and nanosystems-related applications. Recent progress on joining and interconnect formation of key nanomaterials, especially nanowires and carbon nanotubes, into functional circuits and/or prototype devices is reviewed. The nanosoldering technique through nanoscale lead-free solders is discussed in more detail in this Review. Various strategies of fabricating lead-free nanosolders and the utilization of the nanosoldering technique to form functional solder joints are reviewed, and related challenges facing the nanosoldering technique are discussed. A perspective is given for using lead-free nanosolders and the nanosoldering technique for the construction of complex and/or hybrid nanoelectronics and nanosystems.
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