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  • Title: Evaluation of thiouracil-based adhesive systems for bonding cast silver-palladium-copper-gold alloy.
    Author: Yamashita M, Koizumi H, Ishii T, Furuchi M, Matsumura H.
    Journal: J Oral Sci; 2010 Sep; 52(3):405-10. PubMed ID: 20881333.
    Abstract:
    This study aimed to evaluate the effect of adhesive systems based on a thiouracil monomer on bonding to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell M.C.12). Disk specimens were cast from the alloy and then air-abraded with alumina. The disks were bonded using six bonding systems selected from four primers and three luting materials. Shear bond strengths were determined both before and after thermocycling. Bond strength varied from 2.7 MPa to 32.0 MPa. Three systems based on a thiouracil monomer (MTU-6) showed durable bonding to the alloy, with post-thermocycling bond strengths of 22.4 MPa for the Metaltite (MTU-6) primer and Super-Bond, a tri-n-butylborane (TBB) initiated resin, 9.0 MPa for the Multi-Bond II resin, and 8.1 MPa for the Metaltite and Bistite II system. It can be concluded that a combination of thiouracil-based primer and TBB initiated resin is effective for bonding Ag-Pd-Cu-Au alloy.
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