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  • Title: Effect of a low-viscosity adhesive resin on the adhesion of metal brackets to enamel etched with hydrochloric or phosphoric acid combined with conventional adhesives.
    Author: Yetkiner E, Ozcan M, Wegehaupt FJ, Wiegand A, Eden E, Attin T.
    Journal: J Adhes Dent; 2013 Dec; 15(6):575-81. PubMed ID: 23593646.
    Abstract:
    PURPOSE: This study investigated the effect of a low-viscosity adhesive resin (Icon) applied after either hydrochloric (HCl) or phosphoric acid (H3PO4) on the adhesion of metal brackets to enamel. Failure types were analyzed. MATERIALS AND METHODS: The crowns of bovine incisors (N = 20) were sectioned mesio-distally and inciso-gingivally, then randomly assigned to 4 groups according to the following protocols to receive mandibular incisor brackets: 1) H3PO4 (37%)+TransbondXT (3M UNITEK); 2) H3PO4 (37%)+Icon+TransbondXT; 3) HCl (15%)+Icon (DMG)+TransbondXT 4) HCl (15%)+Icon+Heliobond (Ivoclar Vivadent)+TransbondXT. Specimens were stored in distilled water at 37°C for 24 h and thermocycled (5000x, 5°C to 55°C). The shear bond strength (SBS) test was performed using a universal testing machine (1 mm/min). Failure types were classified according to the Adhesive Remnant Index (ARI). Contact angles of adhesive resins were measured (n = 5 per adhesive) on ceramic surfaces. RESULTS: No significant difference in SBS was observed, implying no difference between combinations of adhesive resins and etching agents (p = 0.712; ANOVA). The Weibull distribution presented significantly lower Weibull modulus (m) of group 3 (m = 2.97) compared to other groups (m = 5.2 to 6.6) (p < 0.05). The mean SBS results (MPa) in descending order were as follows: group 4 (46.7 ± 10.3) > group 1 (45.4 ± 7.9) > group 2 (44.2 ± 10.6) > group 3 (42.6 ± 15.5). While in groups 1, 3, and 4 exclusively an ARI score of 0 (no adhesive left on tooth) was observed, in group 2, only one specimen demonstrated score 1 (less than half of adhesive left on tooth). Contact angle measurements were as follows: Icon (25.86 ± 3.81 degrees), Heliobond (31.98 ± 3.17 degrees), TransbondXT (35 ± 2.21 degrees). CONCLUSION: Icon can be safely used with the conventional adhesives tested on surfaces etched with either HCl or H3PO4.
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