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Title: New information on high copper amalgam corrosion. Author: Fairhurst CW, Marek M, Butts MB, Okabe T. Journal: J Dent Res; 1978; 57(5-6):725-9. PubMed ID: 279591. Abstract: Anodic polarization of "pure" Cu6Sn5 was investigated. Cu6Sn5 is found to be passive in nearly neutral synthetic saliva. Anodic corrosion activity (characteristic for tin) previously reported for a high copper amalgam must result from the presence of the gamma2 phase or tin in the matrix phase.[Abstract] [Full Text] [Related] [New Search]