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  • Title: Resin adhesion to the ground young permanent enamel: influence of etching times and thermal cycling test.
    Author: Hosoya Y.
    Journal: J Clin Pediatr Dent; 1994; 18(2):115-22. PubMed ID: 8054290.
    Abstract:
    The purpose of this study was to investigate the influence of etching times and thermal cycling test on resin adhesion on ground young permanent enamel. Two hundred and fifty bovine mandibular young permanent incisors were used. Materials used in this study were 40 phospholic acid gel, Photo Bond and Photo Clearfil A (Kuraray Co., Kurashiki, Japan) in the PCA groups and 37% phospholic acid gel, Scotch Bond and Silux (3M Co., St. Paul, MN) in the Silux groups. The etching times were 0, 10, 20, 30, and 60 seconds. Shear bond strengths were tested. After the shear bond strength test, the test surfaces of the enamel and the resin specimens were observed using the SEM. The etching times that showed the highest bond strengths were 60 seconds both in the Silux non-thermal cycled group (45.21 +/- 8.49 MPa) and the Silux thermal cycled group (33.40 +/- 5.75 MPa), and 20 seconds in the Silux non-thermal cycled group (35.25 +/- 6.60 MPa) and 30 seconds in the PCA thermal cycled group (45.21 +/- 8.49 MPa). In the PCA groups, the bond strengths were significantly increased by thermal cycling tests, however, in the Silux groups, the bond strengths were significantly decreased by thermal cycling tests.
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