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5. Evaluation of 2 thione primers and 3 resin adhesives for silver-palladium-copper-gold alloy bonding. Koishi Y, Tanoue N, Yanagida H, Atsuta M, Nakamura M, Matsumura H. Quintessence Int; 2006 May; 37(5):395-9. PubMed ID: 16683688 [Abstract] [Full Text] [Related]
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