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Pubmed for Handhelds

PUBMED FOR HANDHELDS

Journal Abstract Search

472 related items for PubMed ID: 21676366

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  • 2. The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints.
    Sayyadi R, Naffakh-Moosavy H.
    Sci Rep; 2019 Jun 10; 9(1):8389. PubMed ID: 31182784
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  • 3. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.
    Son J, Yu DY, Kim YC, Kim SI, Kim MS, Byun D, Bang J.
    Materials (Basel); 2021 May 02; 14(9):. PubMed ID: 34063188
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  • 4. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH, Lee JD, Yoon T, Lee CW, Kim TS.
    ACS Appl Mater Interfaces; 2016 Mar 02; 8(8):5679-86. PubMed ID: 26856638
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  • 6. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition.
    Wang Q, Chen H, Wang F.
    Materials (Basel); 2019 Dec 17; 12(24):. PubMed ID: 31861193
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  • 7. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions.
    Ting Tan A, Wen Tan A, Yusof F.
    Sci Technol Adv Mater; 2015 Jun 17; 16(3):033505. PubMed ID: 27877786
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  • 12. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints.
    Song JM, Huang BC, Tarng D, Hung CP, Yasuda K.
    Nanomaterials (Basel); 2020 Jul 25; 10(8):. PubMed ID: 32722382
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  • 13. Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.
    Guo W, Luan T, He J, Yan J.
    Ultrason Sonochem; 2018 Jan 25; 40(Pt A):815-821. PubMed ID: 28946490
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  • 17. Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model.
    Qiu J, Peng Y, Gao P, Li C.
    Materials (Basel); 2021 Apr 30; 14(9):. PubMed ID: 33946308
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  • 20. Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn-Ag-Cu-Bi Solder.
    Shukla V, Ahmed O, Su P, Jiang T.
    Materials (Basel); 2024 Jul 21; 17(14):. PubMed ID: 39063894
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