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4. Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States. Chen N, Yang K, Wang Z, Zhong B, Wang J, Song J, Li Q, Ni J, Sun F, Liu Y, Fan T. ACS Appl Mater Interfaces; 2023 Jul 19; 15(28):34132-34144. PubMed ID: 37405384 [Abstract] [Full Text] [Related]
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