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Pubmed for Handhelds

PUBMED FOR HANDHELDS

Journal Abstract Search

286 related items for PubMed ID: 31861193

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  • 3. Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.
    Xiao J, Tong X, Liang J, Chen Q, Tang Q.
    Heliyon; 2023 Feb; 9(2):e12952. PubMed ID: 36747560
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  • 4. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.
    Wang F, Huang Y, Zhang Z, Yan C.
    Materials (Basel); 2017 Aug 09; 10(8):. PubMed ID: 28792440
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  • 6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions.
    Ting Tan A, Wen Tan A, Yusof F.
    Sci Technol Adv Mater; 2015 Jun 09; 16(3):033505. PubMed ID: 27877786
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  • 7. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
    Zhao D, Zhang K, Ma N, Li S, Yin C, Huo F.
    Materials (Basel); 2020 Feb 12; 13(4):. PubMed ID: 32059528
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  • 9. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.
    Satyanarayan, Prabhu KN.
    Adv Colloid Interface Sci; 2011 Aug 10; 166(1-2):87-118. PubMed ID: 21676366
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  • 10. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
    Li YJ, Yen YW, Chen CM.
    Materials (Basel); 2024 May 04; 17(9):. PubMed ID: 38730955
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  • 11. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper.
    Xiao J, Cheng W, Fu-Kang Q.
    Heliyon; 2024 Mar 15; 10(5):e27010. PubMed ID: 38455589
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  • 12. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints.
    Chen D, Qin J, Zhang X, Liang D, Bai H, Yi J, Yan J.
    Materials (Basel); 2022 Dec 16; 15(24):. PubMed ID: 36556810
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  • 15. Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints.
    Wodak I, Yakymovych A, Svec P, Orovcik L, Khatibi G.
    Appl Nanosci; 2023 Dec 16; 13(11):7379-7385. PubMed ID: 38046828
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  • 16. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C, Zhang K, Gao Y, Wang Y.
    Materials (Basel); 2023 Mar 26; 16(7):. PubMed ID: 37048920
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  • 17. Effect of Zn Addition on Interfacial Reactions and Mechanical Properties Between Eutectic Sn58Bi Solder and ENIG Substrate.
    Zhou S, He S, Nishikawa H.
    J Nanosci Nanotechnol; 2020 Jan 01; 20(1):106-112. PubMed ID: 31383144
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  • 19. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints.
    Song JM, Huang BC, Tarng D, Hung CP, Yasuda K.
    Nanomaterials (Basel); 2020 Jul 25; 10(8):. PubMed ID: 32722382
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