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Pubmed for Handhelds

PUBMED FOR HANDHELDS

Journal Abstract Search

132 related items for PubMed ID: 39063894

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  • 2. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder.
    Li C, Yan Y, Gao T, Xu G.
    Materials (Basel); 2020 Oct 07; 13(19):. PubMed ID: 33036405
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  • 3. Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.
    Xiao J, Tong X, Liang J, Chen Q, Tang Q.
    Heliyon; 2023 Feb 07; 9(2):e12952. PubMed ID: 36747560
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  • 5. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.
    Jeong H, Myung WR, Sung YG, Kim KY, Jung SB.
    J Nanosci Nanotechnol; 2018 Sep 01; 18(9):6316-6320. PubMed ID: 29677789
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  • 7. Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys.
    Yang T, Chen Y, You K, Dong Z, Jia Y, Wang G, Peng J, Cai S, Luo X, Liu C, Wang J.
    Materials (Basel); 2022 Jul 06; 15(14):. PubMed ID: 35888194
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  • 8. Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions.
    Jian M, Hamasha S, Alahmer A, Hamasha M, Wei X, Belhadi MEA, Hamasha K.
    Materials (Basel); 2023 Jan 12; 16(2):. PubMed ID: 36676490
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  • 15. Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.
    Zhang P, Xue S, Liu L, Wang J, Tatsumi H, Nishikawa H.
    Polymers (Basel); 2024 Sep 14; 16(18):. PubMed ID: 39339061
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  • 18. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging.
    Xin M, Wang X, Sun F.
    J Mater Sci Mater Electron; 2022 Sep 14; 33(33):25025-25040. PubMed ID: 38625275
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