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Pubmed for Handhelds

PUBMED FOR HANDHELDS

Journal Abstract Search

181 related items for PubMed ID: 8400446

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  • 5. Surfactant solutions and porous substrates: spreading and imbibition.
    Starov VM.
    Adv Colloid Interface Sci; 2004 Nov 29; 111(1-2):3-27. PubMed ID: 15571660
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  • 6. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.
    Satyanarayan, Prabhu KN.
    Adv Colloid Interface Sci; 2011 Aug 10; 166(1-2):87-118. PubMed ID: 21676366
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  • 9. Structure of dental gallium alloys.
    Herø H, Simensen CJ, Jørgensen RB.
    Biomaterials; 1996 Jul 10; 17(13):1321-6. PubMed ID: 8805980
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  • 10. Micro-XRD study of beta-titanium wires and infrared soldered joints.
    Iijima M, Brantley WA, Baba N, Alapati SB, Yuasa T, Ohno H, Mizoguchi I.
    Dent Mater; 2007 Sep 10; 23(9):1051-6. PubMed ID: 17178150
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  • 12. Surface analysis of porcelain fused to metal systems.
    Johnson T, van Noort R, Stokes CW.
    Dent Mater; 2006 Apr 10; 22(4):330-7. PubMed ID: 16087227
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  • 17. Effect of microtextured surface topography on the wetting behavior of eutectic gallium-indium alloys.
    Kramer RK, Boley JW, Stone HA, Weaver JC, Wood RJ.
    Langmuir; 2014 Jan 21; 30(2):533-9. PubMed ID: 24358994
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  • 19. Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs.
    Wu N, Hu Y, Sun S.
    Materials (Basel); 2020 Mar 11; 13(6):. PubMed ID: 32168807
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  • 20. Leachability of printed wire boards containing leaded and lead-free solder.
    Townsend T, Musson S, Dubey B, Pearson B.
    J Environ Manage; 2008 Sep 11; 88(4):926-31. PubMed ID: 17583415
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